TIMIA Advances on Launch of First LP

TIMIA Advances on Launch of First LP

By: Tomas Ronolski - AllPennyStocks.com News

Monday, March 11, 2019

TIMIA Capital Corporation (TSX-Venture:TCA) could scarcely wait till the opening bell on Monday to loose its latest developments on investors.

The Vancouver-based TCA, a specialty finance company that provides growth capital to technology companies in exchange for payments based on monthly revenue, announced the set up of $10.5 million in its first Limited Partnership ("LP").

External investors will invest $7.6 million in the LP with TIMIA retaining a $2.4-million interest. Additional subscription agreements totaling $500,000 have been received and are expected to close shortly for a total LP value of $10.5 million. 

TIMIA Capital will retain at least a 20% interest in the LP, thus still participating in a proportionate share of the revenue from the current investment portfolio while increasing its consolidated cash position to approximately $8.7 million. 

Assets under management are anticipated to climb from approximately $15 million to approximately $23 million, representing roughly a 55% increase,

According to CEO Mike Walkinshaw, "This transaction is a significant milestone for the Company and its shareholders and reflects the confidence of investors in our strategy and ability to source quality investments.” 

TIMIA shares acquired half a cent, or 2.9%, to 18 cents, late Monday morning, based on volume of 45,000 share


Copyright © 2019 AllPennyStocks.com. All rights reserved. Republication or redistribution of AllPennyStocks.com's content is expressly prohibited without the prior written consent of AllPennyStocks.com. AllPennyStocks.com shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Other Penny Stock Movers

Shares of Biopharma Up After News of Uplisting
Fed’s Preferred Inflation Measure Cements Higher for Longer
Expansion into Taiwan Markets Is Helping Shares of this Blockchain Firm
Most Popular
FREE Newsletter


Back to Top